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Silicon Envelope for the Large Protoype TPC, Page 2 of 2

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Thu Jan 1 01:00:00 1970

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ID	Date	Author	Type	Subject	Text
11	Fri Oct 23 08:09:04 2009	Stephan Hänsel	Measurements	Run 11273 - data	B=0, TPC inbetween but no TPC readout Beam: 3GeV silicon position from TPC-support-ring:
10	Fri Oct 23 08:02:57 2009	Stephan Hänsel	Measurements	Run 11271 - position run	B=0, TPC inbetween but no TPC readout Beam: 3GeV moved silicon to center position
9	Fri Oct 23 07:57:01 2009	Stephan Hänsel	Measurements	Run 11270 - latency scan	B=0, TPC inbetween but no TPC readout scan from 70 to 120 with 1000 events each
8	Fri Oct 23 07:52:52 2009	Stephan Hänsel	Measurements	Run 11269 - Pedestal Run	B=0, TPC inbetween but no TPC readout
7	Thu Oct 22 11:18:34 2009	Stephan Hänsel	Setup	Pictures	Photo Gallery zusätliche Photos:
6	Thu Oct 22 08:04:51 2009	Stephan Hänsel	Setup	geometry - silicon envelope	distance si-sledge-front to silicon-Z-center = 23 cm -> silicon sledge front 35 cm
5	Thu Oct 22 08:02:26 2009	Stephan Hänsel	Setup	Electronics	HV-Kapton-PIN-assignment
4	Fri Feb 27 14:03:53 2009	Stephan Hänsel	Setup	Setup 3D
3	Fri Feb 27 13:34:11 2009	Stephan Hänsel	Measurements	ARCs Noise PIoff + channels 2 repair
2	Wed Feb 25 09:57:15 2009	Stephan Hänsel	Measurements	Sensor IV-Kurven + CV-Messungen (vor Modulbau)
1	Wed Oct 1 11:42:44 2008	stephan hänsel	Setup	Modulkomponenten	MODULE 0 1 Sensor Module (SiLC01): Hybrid: TEC_6D.2.1 /

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