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LP-TPC
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Silicon Envelope for the Large Protoype TPC |
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Message ID: 3
Entry time: Fri Feb 27 13:34:11 2009
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Author: |
Stephan Hänsel |
Type: |
Measurements |
Subject: |
ARCs Noise PIoff + channels 2 repair |
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Noise Peak Inverter Off
(SiLC11b after repair --- b ... 2nd module with same sensors but different hybrid and PA)
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Noise Pioff [ADC*100] |
optical inspection |
Noise Pioff [ADC*100] |
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1ADC-count entspricht ca 770 e- |
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1ADC-count entspricht ca 770 e- |
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CHANNEL |
SiLC01 |
After Repair |
Measurement 06 |
CCU123-16 back Z
repair-action
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5 |
64 |
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142 |
non |
6 |
65 |
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142 |
non |
7 |
80 |
|
135 |
non |
8 |
135 |
good |
72 |
PA-PA rebond |
9 |
80 |
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133 |
non |
10 |
139 |
good |
77 |
PA-PA rebond |
12 |
139 |
good |
76 |
PA-PA rebond |
15 |
73 |
|
59 |
PA-PA rebond |
21 |
145 |
good |
57 |
PA-PA rebond |
73 |
77 |
|
134 |
non |
74 |
70 |
|
135 |
non |
75 |
137 |
good |
62 |
? PA-PA rebond |
137 |
76 |
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137 |
non |
236 |
76 |
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69 |
? PA-PA rebond |
281 |
55 |
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126 |
non |
453 |
67 |
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118 |
non |
570 |
63 |
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61 |
Jakkoo-PA Open |
666 |
64 |
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134 |
non |
668 |
62 |
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136 |
non |
715 |
74 |
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144 |
non |
764 |
67 |
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134 |
non |
765 |
141 |
good |
66 |
PA-PA rebond |
766 |
145 |
good |
65 |
PA-PA rebond |
768 |
136 |
good |
63 |
PA-PA rebond |
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CHANNEL |
SiLC02 |
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21 |
75 |
Jakkoo-PA Open |
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CCU123-17 back X
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63 |
64 |
PA-SE rebond |
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73 |
81 |
? |
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91 |
77 |
PA-PA rebond |
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|
170 |
69 |
? |
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696 |
72 |
PA-SE rebond |
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704 |
67 |
PA-SE rebond |
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719 |
148 |
SE-SE rebond |
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CHANNEL |
SiLC11b |
Measurement 06 |
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CCU119-17 front Z
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13 |
80 |
Jakkoo-PA Open |
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153 |
62 |
Jakkoo-PA Open |
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415 |
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? Remove bond -> IV verbesserung |
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713 |
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? Remove bond -> IV verbesserung |
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CHANNEL |
SiLC12 |
Measurement 02 |
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CCU119-16 front X
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3 |
68 |
Jakkoo-PA Open |
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|
128 |
63 |
? |
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|
346 |
57 |
APV-PA Open |
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|
523 |
128 |
? |
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651 |
71 |
Jakkoo-PA Open |
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652 |
72 |
Jakkoo-PA Open |
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653 |
71 |
Jakkoo-PA Open |
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654 |
71 |
Jakkoo-PA Open |
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655 |
71 |
Jakkoo-PA Open |
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675 |
149 |
? |
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767 |
74 |
? Jakkoo-PA Open |
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