 Fri Oct 23 08:09:04 2009, Stephan Hänsel, Measurements, Run 11273 - data
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B=0, TPC inbetween but no TPC readout
Beam: 3GeV
silicon position from TPC-support-ring: |
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Fri Oct 23 08:02:57 2009, Stephan Hänsel, Measurements, Run 11271 - position run
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B=0, TPC inbetween but no TPC readout
Beam: 3GeV
moved silicon to center position (~58cm from TPC-support-ring) |
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Fri Oct 23 07:57:01 2009, Stephan Hänsel, Measurements, Run 11270 - latency scan
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B=0, TPC inbetween but no TPC readout
scan from 70 to 120 with 1000 events each
root-diagram -> latency ~ 75 |
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Fri Oct 23 07:52:52 2009, Stephan Hänsel, Measurements, Run 11269 - Pedestal Run
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| B=0, TPC inbetween but no TPC readout |
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Thu Oct 22 11:18:34 2009, Stephan Hänsel, Setup, Pictures
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Photo Gallery
zusätliche Photos:
labeled SiLC in front of TPC |
Thu Oct 22 08:04:51 2009, Stephan Hänsel, Setup, geometry - silicon envelope 
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distance si-sledge-front to silicon-Z-center = 23 cm
-> silicon sledge front 35 cm inside from front of TPC-support at a beam position 58 cm from front of TPC-support
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Thu Oct 22 08:02:26 2009, Stephan Hänsel, Setup, Electronics
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HV-Kapton-PIN-assignment
CCUM-to-Module Adapter-Cards |
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Fri Feb 27 14:03:53 2009, Stephan Hänsel, Setup, Setup 3D
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Fri Feb 27 13:34:11 2009, Stephan Hänsel, Measurements, ARCs Noise PIoff + channels 2 repair
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Wed Feb 25 09:57:15 2009, Stephan Hänsel, Measurements, Sensor IV-Kurven + CV-Messungen (vor Modulbau)
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Wed Oct 1 11:42:44 2008, stephan hänsel, Setup, Modulkomponenten
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MODULE 0
1 Sensor Module (SiLC01):
Hybrid: TEC_6D.2.1 / 30216662133923 |