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  Silicon Envelope for the Large Protoype TPC, Page 2 of 2  Not logged in ELOG logo
Entry  Fri Oct 23 08:09:04 2009, Stephan Hänsel, Measurements, Run 11273 - data 
B=0, TPC inbetween but no TPC readout
Beam: 3GeV
silicon position from TPC-support-ring: 
Entry  Fri Oct 23 08:02:57 2009, Stephan Hänsel, Measurements, Run 11271 - position run 
B=0, TPC inbetween but no TPC readout
Beam: 3GeV
moved silicon to center position (~58cm from TPC-support-ring)
Entry  Fri Oct 23 07:57:01 2009, Stephan Hänsel, Measurements, Run 11270 - latency scan 
B=0, TPC inbetween but no TPC readout
scan from 70 to 120 with 1000 events each
root-diagram -> latency ~ 75
Entry  Fri Oct 23 07:52:52 2009, Stephan Hänsel, Measurements, Run 11269 - Pedestal Run 
B=0, TPC inbetween but no TPC readout
Entry  Thu Oct 22 11:18:34 2009, Stephan Hänsel, Setup, Pictures 
Photo Gallery
zusätliche Photos:
labeled SiLC in front of TPC
Entry  Thu Oct 22 08:04:51 2009, Stephan Hänsel, Setup, geometry - silicon envelope SiLC_in_front_of_TPC.jpg
distance si-sledge-front to silicon-Z-center = 23 cm
-> silicon sledge front 35 cm inside from front of TPC-support at a beam position 58 cm from front of TPC-support
Entry  Thu Oct 22 08:02:26 2009, Stephan Hänsel, Setup, Electronics 
HV-Kapton-PIN-assignment 
  
CCUM-to-Module Adapter-Cards 
Entry  Fri Feb 27 14:03:53 2009, Stephan Hänsel, Setup, Setup 3D 090227_TPCEnvelope-3D_copy.png
 
Entry  Fri Feb 27 13:34:11 2009, Stephan Hänsel, Measurements, ARCs Noise PIoff + channels 2 repair NoisePlot.png
 

        
    
        
Entry  Wed Feb 25 09:57:15 2009, Stephan Hänsel, Measurements, Sensor IV-Kurven + CV-Messungen (vor Modulbau) IV-Kurven_Sensors.png
 

    
    
        
            
Entry  Wed Oct 1 11:42:44 2008, stephan hänsel, Setup, Modulkomponenten 
MODULE 0
1 Sensor Module (SiLC01):
   Hybrid: TEC_6D.2.1 / 30216662133923
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