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  Silicon Envelope for the Large Protoype TPC, Page 2 of 2  Not logged in ELOG logo
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ID Datedown Author Type Subject
  11   Fri Oct 23 08:09:04 2009 Stephan HänselMeasurementsRun 11273 - data

B=0, TPC inbetween but no TPC readout

Beam: 3GeV

silicon position from TPC-support-ring: 

     123: x=center, z=56.5 cm (measuring tape: sledge 35cm inside the gap)

     116: x=center, z=57 cm (measuring tape: sledge 35cm inside the gap)

2 APVs dead:

 

apvlatency = 75 (in fedpmc_silc.xml)

  10   Fri Oct 23 08:02:57 2009 Stephan HänselMeasurementsRun 11271 - position run

B=0, TPC inbetween but no TPC readout

Beam: 3GeV

moved silicon to center position (~58cm from TPC-support-ring)

2 APVs dead:

 

apvlatency = 75 (in fedpmc_silc.xml)

 

2-sensor-module in center

1-sensor-module not exactly in center-position:

     12316 -> move out of the magnet 1,5cm

     11917 -> move out of the magnet 1cm

  9   Fri Oct 23 07:57:01 2009 Stephan HänselMeasurementsRun 11270 - latency scan

B=0, TPC inbetween but no TPC readout

scan from 70 to 120 with 1000 events each

root-diagram -> latency ~ 75

-> set apvlatency in fedpmc_silc.xml to 75

  8   Fri Oct 23 07:52:52 2009 Stephan HänselMeasurementsRun 11269 - Pedestal Run

B=0, TPC inbetween but no TPC readout

  7   Thu Oct 22 11:18:34 2009 Stephan HänselSetupPictures

Photo Gallery

zusätliche Photos:

labeled SiLC in front of TPC

  6   Thu Oct 22 08:04:51 2009 Stephan HänselSetupgeometry - silicon envelope

distance si-sledge-front to silicon-Z-center = 23 cm

-> silicon sledge front 35 cm inside from front of TPC-support at a beam position 58 cm from front of TPC-support


CCU119 = 0x77

  • position 7 = I2C16 = SiLC12 -> front X
  • position 1 = I2C17 = SiLC11 -> front Z

CCU123 = 0x7b

  • position 7 = I2C16 = SiLC01 -> back Z
  • position 1 = I2C17 = SiLC02 -> back X
Attachment 1: SiLC_in_front_of_TPC.jpg
SiLC_in_front_of_TPC.jpg
  5   Thu Oct 22 08:02:26 2009 Stephan HänselSetupElectronics

HV-Kapton-PIN-assignment

  

CCUM-to-Module Adapter-Cards

CCUM-to-Module Adapter-Cards Pin-assignment (xls)

  

schematic of the adopted readout (A.Dierlamm)

 

TEC-R2-Hybrid

  4   Fri Feb 27 14:03:53 2009 Stephan HänselSetupSetup 3D
Attachment 1: 090227_TPCEnvelope-3D_copy.png
090227_TPCEnvelope-3D_copy.png
  3   Fri Feb 27 13:34:11 2009 Stephan HänselMeasurementsARCs Noise PIoff + channels 2 repair

 

 

 

 Noise Peak Inverter Off

(SiLC11b after repair --- b ... 2nd module with same sensors but different hybrid and PA)
         
  Noise Pioff [ADC*100] optical inspection Noise Pioff [ADC*100]  
  1ADC-count entspricht ca 770 e-   1ADC-count entspricht ca 770 e-  
CHANNEL SiLC01 After Repair Measurement 06

CCU123-16 back Z

repair-action
5 64   142 non
6 65   142 non
7 80   135 non
8 135 good 72 PA-PA rebond
9 80   133 non
10 139 good 77 PA-PA rebond
12 139 good 76 PA-PA rebond
15 73   59 PA-PA rebond
21 145 good 57 PA-PA rebond
73 77   134 non
74 70   135 non
75 137 good 62 ? PA-PA rebond
137 76   137 non
236 76   69 ? PA-PA rebond
281 55   126 non
453 67   118 non
570 63   61 Jakkoo-PA Open
666 64   134 non
668 62   136 non
715 74   144 non
764 67   134 non
765 141 good 66 PA-PA rebond
766 145 good 65 PA-PA rebond
768 136 good 63 PA-PA rebond
         
         
CHANNEL SiLC02      
21 75 Jakkoo-PA Open  

CCU123-17 back X
63 64 PA-SE rebond    
73 81 ?    
91 77 PA-PA rebond    
170 69 ?    
696 72 PA-SE rebond    
704 67 PA-SE rebond    
719 148 SE-SE rebond    
         
         
CHANNEL SiLC11b Measurement 06   CCU119-17 front Z
13 80 Jakkoo-PA Open    
153 62 Jakkoo-PA Open    
415   ? Remove bond -> IV verbesserung    
713   ? Remove bond -> IV verbesserung    
         
         
CHANNEL SiLC12 Measurement 02   CCU119-16 front X
3 68 Jakkoo-PA Open    
128 63 ?    
346 57 APV-PA Open    
523 128 ?    
651 71 Jakkoo-PA Open    
652 72 Jakkoo-PA Open    
653 71 Jakkoo-PA Open    
654 71 Jakkoo-PA Open    
655 71 Jakkoo-PA Open    
675 149 ?    
767 74 ? Jakkoo-PA Open    

 

Attachment 1: NoisePlot.png
NoisePlot.png
  2   Wed Feb 25 09:57:15 2009 Stephan HänselMeasurementsSensor IV-Kurven + CV-Messungen (vor Modulbau)

 

Object ID Vdepl I bei 300V I bei 450V
ILC-6684-01 53 1,96E-07 2,10E-07
ILC-6684-05 53 1,95E-07 2,16E-07
ILC-6684-19 50 1,98E-07 2,21E-07
ILC-6684-23 50 1,74E-07 1,93E-07
ILC-6684-27 55 2,62E-07 2,77E-07
ILC-6684-34 58 2,30E-07 2,56E-07
Attachment 1: IV-Kurven_Sensors.png
IV-Kurven_Sensors.png
  1   Wed Oct 1 11:42:44 2008 stephan hänselSetupModulkomponenten

MODULE 0

1 Sensor Module (SiLC01):

   Hybrid: TEC_6D.2.1 / 30216662133923

   Sensor: HPK-ILC-6684-01

2 Sensor Module (SiLC02):

   Hybrid: TEC_6D.2.1 / 30216662133993

   Sensor Near: HPK-ILC-6684-19

   Sensor Far: HPK-ILC-6684-05

 

 

MODULE 1

1 Sensor Module (SiLC11b):

   Hybrid: TEC_6D.2.1 / 30216662133904

   Sensor: HPK-ILC-6684-23

2 Sensor Module (SiLC12):

   Hybrid: TEC_6D.2.1 / 30216661605173

   Sensor Near: HPK-ILC-6684-34

   Sensor Far: HPK-ILC-6684-27

 

(OLD - 1 Sensor Module (SiLC11):

   Hybrid: TEC_6D.2.1 / 30216662133922

   Sensor: HPK-ILC-6684-23)

 

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