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LP-TPC
Silicon Envelope for the Large Protoype TPC, Page 2 of 2
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ID
Date
Author
Type
Subject
Text
11
Fri Oct 23 08:09:04 2009
Stephan Hänsel
Measurements
Run 11273 - data
B=0, TPC inbetween but no TPC readout
Beam: 3GeV
silicon position from TPC-support-ring:
10
Fri Oct 23 08:02:57 2009
Stephan Hänsel
Measurements
Run 11271 - position run
B=0, TPC inbetween but no TPC readout
Beam: 3GeV
moved silicon to center position
9
Fri Oct 23 07:57:01 2009
Stephan Hänsel
Measurements
Run 11270 - latency scan
B=0, TPC inbetween but no TPC readout
scan from 70 to 120 with 1000 events
each
8
Fri Oct 23 07:52:52 2009
Stephan Hänsel
Measurements
Run 11269 - Pedestal Run
B=0, TPC inbetween but no TPC readout
7
Thu Oct 22 11:18:34 2009
Stephan Hänsel
Setup
Pictures
Photo
Gallery
zusätliche Photos:
6
Thu Oct 22 08:04:51 2009
Stephan Hänsel
Setup
geometry - silicon envelope
distance si-sledge-front to silicon-Z-center
= 23 cm
-> silicon sledge front 35 cm
5
Thu Oct 22 08:02:26 2009
Stephan Hänsel
Setup
Electronics
HV-Kapton-PIN-assignment
4
Fri Feb 27 14:03:53 2009
Stephan Hänsel
Setup
Setup 3D
3
Fri Feb 27 13:34:11 2009
Stephan Hänsel
Measurements
ARCs Noise PIoff + channels 2 repair
2
Wed Feb 25 09:57:15 2009
Stephan Hänsel
Measurements
Sensor IV-Kurven + CV-Messungen (vor Modulbau)
1
Wed Oct 1 11:42:44 2008
stephan hänsel
Setup
Modulkomponenten
MODULE 0
1 Sensor Module (SiLC01):
Hybrid: TEC_6D.2.1 /
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