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  HEPHY logbook of the Electronics Group, Page 4 of 4  Not logged in ELOG logo
  ID Date Authorup Project Measurement Type Object ID Subject Text Attachments
  2   Tue Apr 22 19:34:09 2008 Markus FriedlSPS Testbeam June08modulehybrid 01Properties of hybrid 01, sensor fully bonded, HV=100VHV bias glued to backplane, HV=100V  6x 
  4   Wed Apr 23 13:37:18 2008 Markus FriedlSPS Testbeam June08sourcehybrid 01analysis results of source testIgnore the "KEK November 2007" title - that's
a legacy and is already changed :-)
  5   Wed Apr 30 16:52:17 2008 Markus FriedlBELLE Upgrademodulemicronmicron sensor glued to framesoeben haben wir den micron-DSSD (double metal
layer) in den 2-teiligen rahmen geklebt und
auf beiden seiten
  14   Tue May 20 14:27:50 2008 Markus FriedlBELLE Upgradesourcemicronanalysis results of source test
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