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electronics module assembly SiDDaTA scratch

HEPHY logbook of the Electronics Group, Page 4 of 4  Not logged in

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Full | Summary | Threaded | Collapse | Expand     -- All entries -- Last day Last 3 Days Last week Last month Last 3 Months Last 6 Months Last Year -- Type -- Common Measurement -- Project -- SPS Testbeam June08 Belle II PixelFED -- Measurement Type -- hybrid module source system  64 Entries

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Selected entries:  Tracker Sensor QC HGC Sensor QC Process QC Longterm Visual Inspection Process QC OLD SQC PQC P3 HGC Klimakammer microscopes infrastructure test cleanroom lasersetup module assembly testbeam-MA2023 testbeam-MA2021 testbeam-MA2020 testbeam-MA2019 testbeam-rd50-desy-Oct2024 testbeam-RD50-DESY-Apr2024 testbeam-RD50-DESY-Jul2023 testbeam-RD50-CERN-Oct2022 testbeam-DESY-Oct2017 testbeam-DESY-April2017 testbeam-SPS2015 testbeam-SPS2014 testbeam-DESY14 testbeam-SPS12 testbeam-SPS11 testbeam-SPS10 testbeam-SPS09 testbeam-SPS08 LP-TPC SiDDaTA scratch testbeam-MA2018 testbeam-MA2024

Tue Apr 22 19:34:09 2008, Markus Friedl, SPS Testbeam June08, module, hybrid 01, Properties of hybrid 01, sensor fully bonded, HV=100V 6x   Wed Apr 23 13:37:18 2008, Markus Friedl, SPS Testbeam June08, source, hybrid 01, analysis results of source test    Wed Apr 30 16:52:17 2008, Markus Friedl, BELLE Upgrade, module, micron, micron sensor glued to frame    Tue May 20 14:27:50 2008, Markus Friedl, BELLE Upgrade, source, micron, analysis results of source test 9x

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