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HEPHY logbook of the Electronics Group, Page 4 of 4
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-- Project --
SPS Testbeam June08
Belle II
PixelFED
-- Measurement Type --
hybrid
module
source
system
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ID
Date
Author
Project
Measurement Type
Object ID
Subject
Text
2
Tue Apr 22 19:34:09 2008
Markus Friedl
SPS Testbeam June08
module
hybrid 01
Properties of hybrid 01, sensor fully bonded, HV=100V
HV bias glued to backplane, HV=100V
6x
4
Wed Apr 23 13:37:18 2008
Markus Friedl
SPS Testbeam June08
source
hybrid 01
analysis results of source test
Ignore the "KEK November 2007" title - that's
a legacy and is already changed :-)
5
Wed Apr 30 16:52:17 2008
Markus Friedl
BELLE Upgrade
module
micron
micron sensor glued to frame
soeben haben wir den micron-DSSD (double metal
layer) in den 2-teiligen rahmen geklebt und
auf beiden seiten
14
Tue May 20 14:27:50 2008
Markus Friedl
BELLE Upgrade
source
micron
analysis results of source test
*** NOTE: AFTER THIS MEASUREMENT WE REALIZED
THAT BIASING WAS NOT DONE PROPERLY
9x
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