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| HEPHY logbook for testbeam at SPS June 2008 |
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Message ID: 7
Entry time: Wed May 14 16:15:30 2008
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| Author: |
Markus Friedl |
| Project: |
BELLE |
| Subject: |
Micron DDD5 Photos |
| Run Number: |
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| Events: |
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This is the new Micron DDD5 double-sided module with 3+3 APV25 readout chips on each side.
The p-side flex hybrid sits at the edge of the sensor, while the n-side flex hybrid is located on top of about
1/3 of the sensor, separated by 1mm of Rohacell.
Sensor data (copied from the Micron catalogue):
DESIGN DDD5 - AC COUPLED ION IMPLANTED TOTALLY DEPLETED DOUBLE SIDED DOUBLE METAL MICROSTRIP DETECTOR
SILICON DETECTOR TYPE: AC coupled ion implanted totally depleted silicon microstrip detector.
DESIGN: Double sided, two metal layers on NN+ 6 inch wafer technology.
JUNCTION SIDE
No STRIPS: 384
STRIP PITCH: 50 µm
OHMIC SIDE
First Metal
No STRIPS: 768
STRIP PITCH: 153.5 µm
Second Metal
No STRIPS: 384
STRIP PITCH: 49.5 µm
POLYSILICON RESISTOR: 2.5 ± 0.5 M
COUPLING CAPACITOR: 100 pF
SILICON THICKNESS: 300 ± 10 µm
CHIP DIMENSIONS: 120.125 x 21.2 mm2
FULL DEPLETION VOLTAGE (FD): 50 V maximum
OPERATING VOLTAGE: FD to 2FD
EXPERIMENTS: D2, FNAL |
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