Home CMS Production Clean room MedAustron HEPHY testbeams old
electronics module assembly SiDDaTA
  HEPHY logbook of the Electronics Group, Page 4 of 4  Not logged in ELOG logo
  ID Date Author Project Measurement Type Object ID Subjectup
  12   Fri May 9 10:00:34 2008 Christian IrmlerSPS Testbeam June08modulemodule 03/10properties (noise, intcal), APVs bonded to the sensor
Module tested with 1 and 2 rows bonded to the sensor, respectively. HV = 100 V Ibias (100 V) = 18.9 nA Ibias (200 V) = 25.5 nA
  13   Fri May 9 10:04:26 2008 Christian IrmlerSPS Testbeam June08modulemodule 05/05properties (noise, intcal), APVs bonded to the sensor
Module tested with 1 and 2 rows bonded to the sensor, respectively. HV = 100 V Ibias (100 V) = 18.0 nA Ibias (200 V) = 23.6 nA
  17   Sun Jul 4 05:48:36 2010 Christian IrmlerBELLE UpgradesourceOrigami 6 - module 1run002: first analysis results

Run name: run002

Run type: 0 (Hardware (Normal Run))
Comments:
After ~40min warmup
HV=80
90Sr 1mCi source - moved compared to run001
multi6

Max. Events=100000      Trg delay=25

Origami 6 module #1
w/o cooling
sensor: B2HPK_10938-9239_8

n-side: all 4 APVs read out
p-side: APV #0 to #3  read out, analog output of #4 and #5 were not connected to FADC board

 

 

  3   Wed Apr 23 13:05:05 2008 Christian IrmlerSPS Testbeam June08sourcehybrid 01time correlation between TDC and sensor measurement -> 3.1 ns RMS
ELOG V3.1.4-966e3dd