Home CMS Production Clean room MedAustron HEPHY testbeams old

electronics module assembly SiDDaTA scratch

HEPHY logbook of the Electronics Group, Page 4 of 4  Not logged in

Find |  Select |  Login |  Help

New entries since: Thu Jan 1 01:00:00 1970

Full | Summary | Threaded     -- All entries -- Last day Last 3 Days Last week Last month Last 3 Months Last 6 Months Last Year -- Type -- Common Measurement -- Project -- SPS Testbeam June08 Belle II PixelFED -- Measurement Type -- hybrid module source system  64 Entries

Goto page Previous  1, 2, 3, 4   All

Selected entries:  Tracker Sensor QC HGC Sensor QC Process QC Longterm Visual Inspection Process QC OLD SQC PQC P3 HGC Klimakammer microscopes infrastructure test cleanroom lasersetup module assembly testbeam-MA2023 testbeam-MA2021 testbeam-MA2020 testbeam-MA2019 testbeam-rd50-desy-Oct2024 testbeam-RD50-DESY-Apr2024 testbeam-RD50-DESY-Jul2023 testbeam-RD50-CERN-Oct2022 testbeam-DESY-Oct2017 testbeam-DESY-April2017 testbeam-SPS2015 testbeam-SPS2014 testbeam-DESY14 testbeam-SPS12 testbeam-SPS11 testbeam-SPS10 testbeam-SPS09 testbeam-SPS08 LP-TPC SiDDaTA scratch testbeam-MA2018 testbeam-MA2024

ID Date Author Project Measurement Type Object ID Subject Text   4   Wed Apr 23 13:37:18 2008 Markus Friedl SPS Testbeam June08 source hybrid 01 analysis results of source test Ignore the "KEK November 2007" title - that's a legacy and is already changed :-)      3   Wed Apr 23 13:05:05 2008 Christian Irmler SPS Testbeam June08 source hybrid 01 time correlation between TDC and sensor measurement -> 3.1 ns RMS        2   Tue Apr 22 19:34:09 2008 Markus Friedl SPS Testbeam June08 module hybrid 01 Properties of hybrid 01, sensor fully bonded, HV=100V HV bias glued to backplane, HV=100V  6x    1   Fri Apr 18 17:23:26 2008 Markus Friedl SPS Testbeam June08 hybrid hybrid 01 Noise of hybrid 01, sensor fully bonded, no HV HV bias not yet glued to backplane

Goto page Previous  1, 2, 3, 4   All

ELOG V3.1.5-fc6679b