Wed Apr 23 13:37:18 2008, Markus Friedl, SPS Testbeam June08, source, hybrid 01, analysis results of source test
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Ignore the "KEK November 2007" title - that's a legacy and is already changed :-)
As of now, there is no distinction in 16 separate zones. However, the gaps between the the zones are clearly visible in the Hit Profile, as the edge strips on both sides have a larger sensitive area and thus collect more hits than other strips; hence the spikes in the (otherwise pretty gaussian) beam profile. There is a single strip with no entries in the center - that's the one that suffered from the bias bond repair action.
SNR=21 (peak mode) is pretty healthy and fits to similar detectors operated with APV25.
All data was taken in multi-peak mode with subsequent hit fitting to obtain amplitude and timing (see separate posting for timing precision).
The verbose output of the analysis is pasted below.
Analysis of vie_run001
Peak Mode, 3 x 200 initevents (first 10 skipped) + 99400 events
Number hybrids: 1 number zones: 2 number sensors: 1
Using calibration file vie_cal001
No pedestal correction file
Seed/Neighbor/Cluster/Noisy Strips Cuts [RMS noise]: 5.0/3.0/5.0
Min. hitlength: 3
Comments:
SILC module 01
HV=100V, 40MHz, Tp=50ns, 30ns
Sr90 1mCi , black cloth cover
Analysis date: 23.04.2008 13:25:09
Analysis settings:
runname: vie_run001_cluster
clock: 40.00 MHz
datafilepath: data/
outputpath: output/
subevents: 6
fitmode: 2 (cal. fit)
options: h
Results:
ModuleName ZoneType Ch OKCh OK% Entries MClW MPSignal Noise MPSNR HpSE Occup
p_side JP single sensor 256 256 100.0 90385 2.53 21546.1 729.4 20.68 0.53 1.81 |
Wed Apr 23 13:05:05 2008, Christian Irmler, SPS Testbeam June08, source, hybrid 01, time correlation between TDC and sensor measurement -> 3.1 ns RMS
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Tue Apr 22 19:34:09 2008, Markus Friedl, SPS Testbeam June08, module, hybrid 01, Properties of hybrid 01, sensor fully bonded, HV=100V 6x
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HV bias glued to backplane, HV=100V |
Fri Apr 18 17:23:26 2008, Markus Friedl, SPS Testbeam June08, hybrid, hybrid 01, Noise of hybrid 01, sensor fully bonded, no HV
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HV bias not yet glued to backplane |
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