Home
CMS Production
Clean room
MedAustron
HEPHY
testbeams
old
electronics
module assembly
SiDDaTA
scratch
HEPHY logbook of the Electronics Group, Page 4 of 4
Not logged in
Find
|
Select
|
Login
|
Help
Full
| Summary |
Threaded
-- All entries --
Last day
Last 3 Days
Last week
Last month
Last 3 Months
Last 6 Months
Last Year
-- Type --
Common
Measurement
-- Project --
SPS Testbeam June08
Belle II
PixelFED
-- Measurement Type --
hybrid
module
source
system
64 Entries
Goto page
Previous
1
,
2
,
3
, 4
All
Selected entries:
Tracker Sensor QC
HGC Sensor QC
Process QC
Longterm
Visual Inspection
Process QC OLD
SQC
PQC
P3
HGC
Klimakammer
microscopes
infrastructure
test
cleanroom
lasersetup
module assembly
testbeam-MA2023
testbeam-MA2021
testbeam-MA2020
testbeam-MA2019
testbeam-rd50-desy-Oct2024
testbeam-RD50-DESY-Apr2024
testbeam-RD50-DESY-Jul2023
testbeam-RD50-CERN-Oct2022
testbeam-DESY-Oct2017
testbeam-DESY-April2017
testbeam-SPS2015
testbeam-SPS2014
testbeam-DESY14
testbeam-SPS12
testbeam-SPS11
testbeam-SPS10
testbeam-SPS09
testbeam-SPS08
LP-TPC
SiDDaTA
scratch
testbeam-MA2018
testbeam-MA2024
ID
Date
Author
Project
Measurement Type
Object ID
Subject
Text
4
Wed Apr 23 13:37:18 2008
Markus Friedl
SPS Testbeam June08
source
hybrid 01
analysis results of source test
Ignore the "KEK November 2007" title - that's
a legacy and is already changed :-)
3
Wed Apr 23 13:05:05 2008
Christian Irmler
SPS Testbeam June08
source
hybrid 01
time correlation between TDC and sensor measurement -> 3.1 ns RMS
2
Tue Apr 22 19:34:09 2008
Markus Friedl
SPS Testbeam June08
module
hybrid 01
Properties of hybrid 01, sensor fully bonded, HV=100V
HV bias glued to backplane, HV=100V
6x
1
Fri Apr 18 17:23:26 2008
Markus Friedl
SPS Testbeam June08
hybrid
hybrid 01
Noise of hybrid 01, sensor fully bonded, no HV
HV bias not yet glued to backplane
Goto page
Previous
1
,
2
,
3
, 4
All
ELOG V3.1.5-fc6679b