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electronics module assembly SiDDaTA
  HEPHY logbook of the Electronics Group, Page 3 of 4  Not logged in ELOG logo
ID Date Author Projectup Measurement Type Object ID Subject Text Attachments
  55   Mon Nov 30 17:23:51 2015 Hao YinBelle IIsystemHardwareRun001 ADC Hot, FIRRun001, PedestalRun001

room temp pedrun

target: BW
 Room_bw_n.pngRoom_bw_p.png 
  56   Mon Nov 30 17:47:54 2015 Hao YinBelle IIsystemHardwareRun002 ADC Hot, FIRRun001, PedestalRun001

target: -Z

room temp pedrun
 Room_-z_n.pngRoom_-z_p.png 
  57   Mon Nov 30 18:32:13 2015 Hao YinBelle IIsystemADC Delay Scan Cold ADC Cold diff to hot: 1-3 adc delay config
(max 1.5 ns)
  
  58   Mon Nov 30 18:44:04 2015 Hao YinBelle IIsystemFIRRun_Cold ADC Cold diff to hot: 1-3 adc delay config
(max 1.5 ns)

 
  
  59   Mon Nov 30 18:45:49 2015 Hao YinBelle IIsystemPedestalRun_Cold ADC Cold diff to hot: 1-3 adc delay config
(max 1.5 ns), FIRRun_Cold_001

 
  
  60   Mon Nov 30 18:49:23 2015 Hao YinBelle IIsystemHardware_Cold ADC Cold diff to hot: 1-3 adc delay config
(max 1.5 ns), FIRRun_Cold_001

target: -Z
 Cold_-z_n.pngCold_-z_p.png 
  61   Mon Nov 30 19:01:54 2015 Hao YinBelle IIsystemHardware_Cold ADC Cold diff to hot: 1-3 adc delay config
(max 1.5 ns), FIRRun_Cold_001

Temp = 0°C
 Cold_ce_n.pngCold_ce_p.png 
  62   Mon Nov 30 19:48:05 2015 Hao YinBelle IIsystemHardware_Room_With_Cold_I2C ADC Cold diff to hot: 1-3 adc delay config
(max 1.5 ns), FIRRun_Cold_001

with room temp i2c config
 RoomTemp_with_cold_config_ce_p.pngRoomTemp_with_cold_config_ce_n.png 
  63   Mon Nov 30 20:06:15 2015 Hao YinBelle IIsystemHardware_Room_With_Cold_I2C ADC Cold diff to hot: 1-3 adc delay config
(max 1.5 ns), FIRRun_Cold_001

with room temp i2c config
 RoomTemp_with_cold_config_-z_p.pngRoomTemp_with_cold_config_-z_n.png 
  64   Mon Nov 30 20:16:37 2015 Hao YinBelle IIsystemHardware_Room_With_Cold_I2C ADC Cold diff to hot: 1-3 adc delay config
(max 1.5 ns), FIRRun_Cold_001

ADC delay shifted by 3 (1.5ns)
 RoomTemp_with_cold_config_-z_p_3.pngRoomTemp_with_cold_config_-z_n_3.png 
  65   Mon Nov 30 20:27:42 2015 Hao YinBelle IIsystemHardware_Room_With_Cold_I2C ADC Cold diff to hot: 1-3 adc delay config
(max 1.5 ns), FIRRun_Cold_001

ADC shifted by 5 (2.5ns) all sensors
 RoomTemp_with_cold_config_-z_p_5.pngRoomTemp_with_cold_config_-z_n_5.png 
  67   Mon Nov 30 22:35:41 2015 Hao YinBelle IIsystemHardware_Room_With_Cold_I2C ADC Cold diff to hot: 1-3 adc delay config
(max 1.5 ns), FIRRun_Cold_001

ADC shifted by 9 (4.5ns) all sensors
 RoomTemp_with_cold_config_-z_p_9.pngRoomTemp_with_cold_config_-z_n_9.png 
  1   Fri Apr 18 17:23:26 2008 Markus FriedlSPS Testbeam June08hybridhybrid 01Noise of hybrid 01, sensor fully bonded, no HVHV bias not yet glued to backplane  hybrid01_sen_nohv_pednoise_apv0.pnghybrid01_sen_nohv_pednoise_apv1.png 
  2   Tue Apr 22 19:34:09 2008 Markus FriedlSPS Testbeam June08modulehybrid 01Properties of hybrid 01, sensor fully bonded, HV=100VHV bias glued to backplane, HV=100V  6x 
  3   Wed Apr 23 13:05:05 2008 Christian IrmlerSPS Testbeam June08sourcehybrid 01time correlation between TDC and sensor measurement -> 3.1 ns RMS   vie_run001_tpeak_vs_TDC.gif 
  4   Wed Apr 23 13:37:18 2008 Markus FriedlSPS Testbeam June08sourcehybrid 01analysis results of source testIgnore the "KEK November 2007" title - that's
a legacy and is already changed :-)
 vie_run001_cluster_sig_0.gifvie_run001_cluster_noi_0.gifvie_run001_cluster_hit_0.gifvie_run001_cluster_clw_0.gif 
  6   Wed May 7 15:24:49 2008 Christian IrmlerSPS Testbeam June08modulemodule 10/02properties (noise, intcal), APVs bonded to the sensorModule tested with 1 and 2 rows bonded to
the sensor, respectively.
HV = 100 V
Ibias
(100V) = 19.1 nA
Ibias (200V) = 23.7 nA
 12x 
  9   Wed May 7 15:26:24 2008 Christian IrmlerSPS Testbeam June08modulemodule 20/09properties (noise, intcal), APVs bonded to the sensorModule tested with 1 and 2 rows bonded to
the sensor, respectively. 
HV = 100 V
Ibias
(100 V) = 25.1 nA
Ibias (200 V) = 31.4 nA
 12x 
  8   Wed May 7 15:40:07 2008 Christian IrmlerSPS Testbeam June08modulemodule 07/07properties (noise, intcal), APVs bonded to the sensorModule tested with 1 and 2 rows bonded to
the sensor, respectively. 
HV = 100 V
Ibias
(100 V) = 20.2 nA
Ibias (200 V) = 21.9 nA
 12x 
  7   Wed May 7 16:12:58 2008 Christian IrmlerSPS Testbeam June08modulemodule 12/08properties (noise, intcal), APVs bonded to the sensorModule tested with 1 and 2 rows bonded to
the sensor, respectively. 
HV = 100 V
Ibias
(100 V) = 22.2 nA
Ibias (200 V) = 26.5 nA
 12x 
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