Home CMS Production Clean room MedAustron HEPHY testbeams old
electronics module assembly SiDDaTA scratch
  HEPHY logbook of the Electronics Group, Page 3 of 4  Not logged in ELOG logo
ID Date Author Projectup Measurement Type Object ID Subject
  55   Mon Nov 30 17:23:51 2015 Hao YinBelle IIsystemHardwareRun001 

ADC Hot, FIRRun001, PedestalRun001

room temp pedrun

target: BW

Attachment 1: Room_bw_n.png
Room_bw_n.png
Attachment 2: Room_bw_p.png
Room_bw_p.png
  56   Mon Nov 30 17:47:54 2015 Hao YinBelle IIsystemHardwareRun002 

ADC Hot, FIRRun001, PedestalRun001

target: -Z

room temp pedrun

 

Attachment 1: Room_-z_n.png
Room_-z_n.png
Attachment 2: Room_-z_p.png
Room_-z_p.png
  57   Mon Nov 30 18:32:13 2015 Hao YinBelle IIsystemADC Delay Scan Cold 

ADC Cold diff to hot: 1-3 adc delay config (max 1.5 ns)

  58   Mon Nov 30 18:44:04 2015 Hao YinBelle IIsystemFIRRun_Cold 

ADC Cold diff to hot: 1-3 adc delay config (max 1.5 ns)

 

  59   Mon Nov 30 18:45:49 2015 Hao YinBelle IIsystemPedestalRun_Cold 

ADC Cold diff to hot: 1-3 adc delay config (max 1.5 ns), FIRRun_Cold_001

 

  60   Mon Nov 30 18:49:23 2015 Hao YinBelle IIsystemHardware_Cold 

ADC Cold diff to hot: 1-3 adc delay config (max 1.5 ns), FIRRun_Cold_001

target: -Z

 

Attachment 1: Cold_-z_n.png
Cold_-z_n.png
Attachment 2: Cold_-z_p.png
Cold_-z_p.png
  61   Mon Nov 30 19:01:54 2015 Hao YinBelle IIsystemHardware_Cold 

ADC Cold diff to hot: 1-3 adc delay config (max 1.5 ns), FIRRun_Cold_001

Temp = 0°C

target: CE

 

Attachment 1: Cold_ce_n.png
Cold_ce_n.png
Attachment 2: Cold_ce_p.png
Cold_ce_p.png
  62   Mon Nov 30 19:48:05 2015 Hao YinBelle IIsystemHardware_Room_With_Cold_I2C 

ADC Cold diff to hot: 1-3 adc delay config (max 1.5 ns), FIRRun_Cold_001

with room temp i2c config

Temp = 0°C

target: CE

 

Attachment 1: RoomTemp_with_cold_config_ce_p.png
RoomTemp_with_cold_config_ce_p.png
Attachment 2: RoomTemp_with_cold_config_ce_n.png
RoomTemp_with_cold_config_ce_n.png
  63   Mon Nov 30 20:06:15 2015 Hao YinBelle IIsystemHardware_Room_With_Cold_I2C 

ADC Cold diff to hot: 1-3 adc delay config (max 1.5 ns), FIRRun_Cold_001

with room temp i2c config

Temp = room

target: -Z

 

Attachment 1: RoomTemp_with_cold_config_-z_p.png
RoomTemp_with_cold_config_-z_p.png
Attachment 2: RoomTemp_with_cold_config_-z_n.png
RoomTemp_with_cold_config_-z_n.png
  64   Mon Nov 30 20:16:37 2015 Hao YinBelle IIsystemHardware_Room_With_Cold_I2C 

ADC Cold diff to hot: 1-3 adc delay config (max 1.5 ns), FIRRun_Cold_001

ADC delay shifted by 3 (1.5ns) all sensors

with room temp i2c config

Temp = room

target: -Z

 

Attachment 1: RoomTemp_with_cold_config_-z_p_3.png
RoomTemp_with_cold_config_-z_p_3.png
Attachment 2: RoomTemp_with_cold_config_-z_n_3.png
RoomTemp_with_cold_config_-z_n_3.png
  65   Mon Nov 30 20:27:42 2015 Hao YinBelle IIsystemHardware_Room_With_Cold_I2C 

ADC Cold diff to hot: 1-3 adc delay config (max 1.5 ns), FIRRun_Cold_001

ADC shifted by 5 (2.5ns) all sensors

with room temp i2c config

Temp = room

target: -Z

Note : n-side (strip nr 200 - 220 shadowhits)

Attachment 1: RoomTemp_with_cold_config_-z_p_5.png
RoomTemp_with_cold_config_-z_p_5.png
Attachment 2: RoomTemp_with_cold_config_-z_n_5.png
RoomTemp_with_cold_config_-z_n_5.png
  67   Mon Nov 30 22:35:41 2015 Hao YinBelle IIsystemHardware_Room_With_Cold_I2C 

ADC Cold diff to hot: 1-3 adc delay config (max 1.5 ns), FIRRun_Cold_001

ADC shifted by 9 (4.5ns) all sensors

with room temp i2c config

Temp = room

target: -Z

Attachment 1: RoomTemp_with_cold_config_-z_p_9.png
RoomTemp_with_cold_config_-z_p_9.png
Attachment 2: RoomTemp_with_cold_config_-z_n_9.png
RoomTemp_with_cold_config_-z_n_9.png
  1   Fri Apr 18 17:23:26 2008 Markus FriedlSPS Testbeam June08hybridhybrid 01Noise of hybrid 01, sensor fully bonded, no HV
HV bias not yet glued to backplane
Attachment 1: hybrid01_sen_nohv_pednoise_apv0.png
hybrid01_sen_nohv_pednoise_apv0.png
Attachment 2: hybrid01_sen_nohv_pednoise_apv1.png
hybrid01_sen_nohv_pednoise_apv1.png
  2   Tue Apr 22 19:34:09 2008 Markus FriedlSPS Testbeam June08modulehybrid 01Properties of hybrid 01, sensor fully bonded, HV=100V
HV bias glued to backplane, HV=100V
Attachment 1: hybrid01_sen_hv100V_cal_apv0.png
hybrid01_sen_hv100V_cal_apv0.png
Attachment 2: hybrid01_sen_hv100V_cal_apv1.png
hybrid01_sen_hv100V_cal_apv1.png
Attachment 3: hybrid01_sen_hv100V_pednoise_apv0.png
hybrid01_sen_hv100V_pednoise_apv0.png
Attachment 4: hybrid01_sen_hv100V_pednoise_apv1.png
hybrid01_sen_hv100V_pednoise_apv1.png
Attachment 5: hybrid01_sen_hv100V_cmnoise_apv0.png
hybrid01_sen_hv100V_cmnoise_apv0.png
Attachment 6: hybrid01_sen_hv100V_cmnoise_apv1.png
hybrid01_sen_hv100V_cmnoise_apv1.png
  3   Wed Apr 23 13:05:05 2008 Christian IrmlerSPS Testbeam June08sourcehybrid 01time correlation between TDC and sensor measurement -> 3.1 ns RMS
Attachment 1: vie_run001_tpeak_vs_TDC.gif
vie_run001_tpeak_vs_TDC.gif
  4   Wed Apr 23 13:37:18 2008 Markus FriedlSPS Testbeam June08sourcehybrid 01analysis results of source test
Ignore the "KEK November 2007" title - that's a legacy and is already changed :-)

As of now, there is no distinction in 16 separate zones. However, the gaps between the the zones are clearly visible in the Hit Profile, as the edge strips on both sides have a larger sensitive area and thus collect more hits than other strips; hence the spikes in the (otherwise pretty gaussian) beam profile. There is a single strip with no entries in the center - that's the one that suffered from the bias bond repair action.
SNR=21 (peak mode) is pretty healthy and fits to similar detectors operated with APV25.
All data was taken in multi-peak mode with subsequent hit fitting to obtain amplitude and timing (see separate posting for timing precision).

The verbose output of the analysis is pasted below.


Analysis of vie_run001

Peak Mode, 3 x 200 initevents (first 10 skipped) + 99400 events
Number hybrids:  1	number zones:  2	 number sensors:  1
Using calibration file vie_cal001
No pedestal correction file
Seed/Neighbor/Cluster/Noisy Strips Cuts [RMS noise]: 5.0/3.0/5.0
Min. hitlength:   3


Comments:
SILC module 01
HV=100V, 40MHz, Tp=50ns, 30ns
Sr90 1mCi ,  black cloth cover



Analysis date: 23.04.2008 13:25:09


Analysis settings:
 runname: vie_run001_cluster
 clock: 40.00 MHz
 datafilepath: data/
 outputpath: output/
 subevents:  6
 fitmode: 2 (cal. fit)
 options: h




Results:

ModuleName           ZoneType    Ch    OKCh     OK%   Entries    MClW    MPSignal   Noise   MPSNR   HpSE  Occup
p_side            JP single sensor    256    256   100.0     90385    2.53    21546.1    729.4   20.68   0.53   1.81
Attachment 1: vie_run001_cluster_sig_0.gif
vie_run001_cluster_sig_0.gif
Attachment 2: vie_run001_cluster_noi_0.gif
vie_run001_cluster_noi_0.gif
Attachment 3: vie_run001_cluster_hit_0.gif
vie_run001_cluster_hit_0.gif
Attachment 4: vie_run001_cluster_clw_0.gif
vie_run001_cluster_clw_0.gif
  6   Wed May 7 15:24:49 2008 Christian IrmlerSPS Testbeam June08modulemodule 10/02properties (noise, intcal), APVs bonded to the sensor
Module tested with 1 and 2 rows bonded to the sensor, respectively. HV = 100 V Ibias (100V) = 19.1 nA Ibias (200V) = 23.7 nA
Attachment 1: modul1002_1row_cal_apv0.png
modul1002_1row_cal_apv0.png
Attachment 2: modul1002_1row_cal_apv1.png
modul1002_1row_cal_apv1.png
Attachment 3: modul1002_1row_cmnoise_apv0.png
modul1002_1row_cmnoise_apv0.png
Attachment 4: modul1002_1row_cmnoise_apv1.png
modul1002_1row_cmnoise_apv1.png
Attachment 5: modul1002_1row_pednoise_apv0.png
modul1002_1row_pednoise_apv0.png
Attachment 6: modul1002_1row_pednoise_apv1.png
modul1002_1row_pednoise_apv1.png
Attachment 7: modul1002_final_cal_apv0.png
modul1002_final_cal_apv0.png
Attachment 8: modul1002_final_cal_apv1.png
modul1002_final_cal_apv1.png
Attachment 9: modul1002_final_cmnoise_apv0.png
modul1002_final_cmnoise_apv0.png
Attachment 10: modul1002_final_cmnoise_apv1.png
modul1002_final_cmnoise_apv1.png
Attachment 11: modul1002_final_pednoise_apv0.png
modul1002_final_pednoise_apv0.png
Attachment 12: modul1002_final_pednoise_apv1.png
modul1002_final_pednoise_apv1.png
  9   Wed May 7 15:26:24 2008 Christian IrmlerSPS Testbeam June08modulemodule 20/09properties (noise, intcal), APVs bonded to the sensor
Module tested with 1 and 2 rows bonded to the sensor, respectively. HV = 100 V Ibias (100 V) = 25.1 nA Ibias (200 V) = 31.4 nA
Attachment 1: modul2009_1row_cal_apv0.png
modul2009_1row_cal_apv0.png
Attachment 2: modul2009_1row_cal_apv1.png
modul2009_1row_cal_apv1.png
Attachment 3: modul2009_1row_cmnoise_apv0.png
modul2009_1row_cmnoise_apv0.png
Attachment 4: modul2009_1row_cmnoise_apv1.png
modul2009_1row_cmnoise_apv1.png
Attachment 5: modul2009_1row_pednoise_apv0.png
modul2009_1row_pednoise_apv0.png
Attachment 6: modul2009_1row_pednoise_apv1.png
modul2009_1row_pednoise_apv1.png
Attachment 7: modul2009_final_cal_apv0.png
modul2009_final_cal_apv0.png
Attachment 8: modul2009_final_cal_apv1.png
modul2009_final_cal_apv1.png
Attachment 9: modul2009_final_cmnoise_apv0.png
modul2009_final_cmnoise_apv0.png
Attachment 10: modul2009_final_cmnoise_apv1.png
modul2009_final_cmnoise_apv1.png
Attachment 11: modul2009_final_pednoise_apv0.png
modul2009_final_pednoise_apv0.png
Attachment 12: modul2009_final_pednoise_apv1.png
modul2009_final_pednoise_apv1.png
  8   Wed May 7 15:40:07 2008 Christian IrmlerSPS Testbeam June08modulemodule 07/07properties (noise, intcal), APVs bonded to the sensor
Module tested with 1 and 2 rows bonded to the sensor, respectively. HV = 100 V Ibias (100 V) = 20.2 nA Ibias (200 V) = 21.9 nA
Attachment 1: modul0707_1row_cal_apv0.png
modul0707_1row_cal_apv0.png
Attachment 2: modul0707_1row_cal_apv1.png
modul0707_1row_cal_apv1.png
Attachment 3: modul0707_1row_cmnoise_apv0.png
modul0707_1row_cmnoise_apv0.png
Attachment 4: modul0707_1row_cmnoise_apv1.png
modul0707_1row_cmnoise_apv1.png
Attachment 5: modul0707_1row_pednoise_apv0.png
modul0707_1row_pednoise_apv0.png
Attachment 6: modul0707_1row_pednoise_apv1.png
modul0707_1row_pednoise_apv1.png
Attachment 7: modul0707_final_cal_apv0.png
modul0707_final_cal_apv0.png
Attachment 8: modul0707_final_cal_apv1.png
modul0707_final_cal_apv1.png
Attachment 9: modul0707_final_cmnoise_apv0.png
modul0707_final_cmnoise_apv0.png
Attachment 10: modul0707_final_cmnoise_apv1.png
modul0707_final_cmnoise_apv1.png
Attachment 11: modul0707_final_pednoise_apv0.png
modul0707_final_pednoise_apv0.png
Attachment 12: modul0707_final_pednoise_apv1.png
modul0707_final_pednoise_apv1.png
  7   Wed May 7 16:12:58 2008 Christian IrmlerSPS Testbeam June08modulemodule 12/08properties (noise, intcal), APVs bonded to the sensor
Module tested with 1 and 2 rows bonded to the sensor, respectively. HV = 100 V Ibias (100 V) = 22.2 nA Ibias (200 V) = 26.5 nA
Attachment 1: modul1208_1row_cal_apv0.png
modul1208_1row_cal_apv0.png
Attachment 2: modul0707_1row_cal_apv1.png
modul0707_1row_cal_apv1.png
Attachment 3: modul0707_1row_cmnoise_apv0.png
modul0707_1row_cmnoise_apv0.png
Attachment 4: modul0707_1row_cmnoise_apv1.png
modul0707_1row_cmnoise_apv1.png
Attachment 5: modul0707_1row_pednoise_apv0.png
modul0707_1row_pednoise_apv0.png
Attachment 6: modul0707_1row_pednoise_apv1.png
modul0707_1row_pednoise_apv1.png
Attachment 7: modul0707_final_cal_apv0.png
modul0707_final_cal_apv0.png
Attachment 8: modul0707_final_cal_apv1.png
modul0707_final_cal_apv1.png
Attachment 9: modul0707_final_cmnoise_apv0.png
modul0707_final_cmnoise_apv0.png
Attachment 10: modul0707_final_cmnoise_apv1.png
modul0707_final_cmnoise_apv1.png
Attachment 11: modul0707_final_pednoise_apv0.png
modul0707_final_pednoise_apv0.png
Attachment 12: modul0707_final_pednoise_apv1.png
modul0707_final_pednoise_apv1.png
ELOG V3.1.5-fc6679b